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products and specifications discussed herein are subject to change by aptina without notice. specifications discussed herein ar e subject to change without notice. this product is sold as is and is delivered with no guarantees or warranties, express or implied. MT9M012: 1.6mp cmos digital image sensor die features pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 1 ?2008 aptina imaging corporation all rights reserved. 1/4.5-inch, 1.6mp cmos digital image sensor die MT9M012 for the product data sheet, refer to aptinas web site: www.aptina.com features ? digitalclarity ? cmos imaging technology ? high frame rate (1280h x 720v/50 fps) ? superior low-light performance ?low dark current ? global reset release (grr) for simultaneous exposure of all rows ? simple two-wire serial interface ? programmable controls: gain , frame rate, frame size, exposure ? horizontal and vertical mirror image ? automatic black level calibration ? on-die phase-locked loop (pll) oscillator ? bulb exposure mode for arbitrary exposure times ? snapshot mode to take frames on demand ? parallel data output ? electronic rolling shutter (ers), progressive scan ? arbitrary image decimati on with anti-aliasing ? programmable power-down mode (mode a or mode b) ? xenon and led flash support with fast exposure adaptation ? flexible support for external auto focus, optical zoom, and mechanical shutter general physical specifications ? die thickness: 200m 12m (consult factory for other thickness) ? backside wafer surface of bare silicon ? typical metal 1 thickness: 3.1k? ? typical metal 2 thickness: 3.1k? ? typical metal 3 thickness: 6.1k? ? metallization composition: 99.5 percent al and 0.5 percent cu over ti ? typical topside passivation: 2.2k? nitride over 6.0k? of undoped oxide ? passivation openings (min): 75m x 90m order information MT9M012d00stm die database ? die outline, see figure 2 on page 11 ? singulated die size ? 6,748m 25m x 6,351m 25m ? bond pad identification tables, see pages 5?10 notes: 1. consult die distributor or factory before ordering to verify long-term availability of these die products. key performance parameters ? optical format: 1/4.5-inch (4:3) ? active imager size: 3.24mm(h) x 2.41mm(v), 4.04mm diagonal ? active pixels: 1472h x 1096v ? pixel size: 2.2m x 2.2m ? color filter array: monochrome ? shutter type ? global reset release (grr), snapshot only ? electronic rolling shutter (ers) ? maximum data rate: 82 mp/s ? master clock: 41 mhz ?frame rate ? 1440h x 1080v, programmable up to 30 fps ? 1280h x 720v, programmable up to 50 fps ? adc resolution: 12-bit, on-die ? responsivity: 1.4 v/lux-sec (550nm) ? dynamic range: 70.1db ? snr max: 38.1db options designator ?form ? die d ?testing ? standard (level 1) probe c1 MT9M012d00stm product# chrom temp form die database testing level
pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 2 ?2008 aptina imaging corporation. all rights reserved. MT9M012: 1.6mp cmos digital image sensor die key performance parameters (continued) key performance parameters (continued) ? supply voltage ? digital: 1.7?1.9v ? i/o: 2.6?3.1v ? pll: 2.6?3.1v ? analog: 2.6?3.1v ? power consumption: 364.6mw at 2.8v (parallel) ? operating temperature: ?30c to +70c general description the aptina? MT9M012 is a 1/4.5-inch format cmos active-pixel digital image sensor die with a pixel array of 1472h x 1096v. the default active imaging array size is 1440h x 1080v. it incorporates sophisticated on-die camera functions such as windowing, mirroring, and snapshot mode. it is programmable through a simple two-wire serial interface and has very low power consumption. the MT9M012 digital image sensor die features digitalclarity?the breakthrough low- noise cmos imaging technology that achi eves near-ccd image quality (based on signal-to-noise ratio and low-light sensitivity) while maintaining the inherent size, cost, and integration advantages of cmos. die testing procedures aptina imager die products are tested with a standard probe (c1) test level. wafer probe is performed at an elevated temperature to ensure product functionality in aptina?s stan- dard package. because the package environment is not within aptina?s control, the user must determine the necessary heat sink requirements to ensure that the die junction temperature remains within specified limits. image quality is verified through various imag ing tests. the probe functional test flow provides test coverage for the on-die adc, logic, serial interface bus, and pixel array. test conditions, margins, limits, and test sequen ce are determined by individual product yields and reliability data. aptina retains a wafer map of each wafer as part of the probe records, along with a lot summary of wafer yields for each lot probed . aptina reserves the right to change the probe program at any time to improve the reli ability, packaged device yield, or perfor- mance of the product. die users may experience differences in performance relative to aptina?s data sheets. this is due to differences in package capacitance, inductance, resistance, and trace length. functional specifications these specifications are provided for reference only. for target functional and para- metric specifications, refer to the product data sheet found on aptina?s web site.
pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 3 ?2008 aptina imaging corporation. all rights reserved. MT9M012: 1.6mp cmos digital image sensor die bonding instructions bonding instructions the MT9M012 imager die has 124 bond pads. refer to table 1 and table 2 on pages 5?10 for a complete list of bond pads and coordinates. the MT9M012 imager die does not require the user to determine bond option features. the die also has several pads defined as ?do not use.? these pads are reserved for engi- neering purposes and should not be used. bonding these pads could result in a nonfunctional die. figure 1 on page 4 shows the MT9M012 typical die connections. for low-noise opera- tion, the MT9M012 die requires separate su pplies for analog and digital power. power supply rails should be decoupled to ground using capacitors. the use of inductance filters is not recommended. all d gnd pads must be tied together, as must all a gnd pads, all v dd _io pads, and all v dd pads. doing so will minimize risk of damage to the sensor in an esd event. storage requirements aptina die products are packaged in for shipping a cleanroom environment. upon receipt, the customer should transfer the die to a similar environment for storage. aptina recommends the die be maintained in a filt ered nitrogen atmosphere until removed for assembly. the moisture content of the stor age facility should be maintained at 30 percent relative humidity 10 percent. esd damage precautions are necessary during handling. the die must be in an esd-protected environment at all times for inspection and assembly.
pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 4 ?2008 aptina imaging corporation. all rights reserved. MT9M012: 1.6mp cmos digital image sensor die typical configuration typical configuration figure 1: typical configuration (connection) parallel mode notes: 1. typical connection shows only one scenario out of multiple possible variations for this sensor. 2. all inputs must be configured with v dd _io. 3. v aa and vaa_pix must be tied together. 4. all power supplies should be adequately decoupled. 5. all d gnd pads must be tied together, as must all a gnd pads, all v aa , all vaa_pix, all v dd _io pads, and all v dd pads. d out [11:0] frame_valid pixclk strobe line_valid reset_bar sclk s data trigger extclk vdd_io v dd v dd _pll vaa_pix v aa a gnd MT9M012 10k 1.5k v dd _io v aa v dd _pll v dd 1f test d gnd from controller master clock to image processor 1.5k 10kC100k
pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 5 ?2008 aptina imaging corporation. all rights reserved. MT9M012: 1.6mp cmos digital image sensor die bond pad identification tables bond pad identification tables table 1: bond pad location and identification from center of pad 1 pad name pad number x 1 microns y 1 microns x 1 inches y 1 inches 1v dd _io1 0.00 0.00 0.0000000 0.0000000 2v dd _io2 141.84 0.00 0.0055843 0.0000000 3v dd _io9 283.68 0.00 0.0111685 0.0000000 4d gnd 10 414.72 0.00 0.0163276 0.0000000 5 trigger 568.14 0.00 0.0223675 0.0000000 6v dd _io10 726.48 0.00 0.0286016 0.0000000 7d gnd 11 857.52 0.00 0.0337606 0.0000000 8d out 0 1050.32 0.00 0.0413512 0.0000000 9v dd _io11 1232.64 0.00 0.0485291 0.0000000 10 d gnd 12 1363.68 0.00 0.0536882 0.0000000 11 frame_valid 1556.48 0.00 0.0612787 0.0000000 12 v dd _io12 1738.80 0.00 0.0684567 0.0000000 13 d gnd 13 1869.84 0.00 0.0736157 0.0000000 14 line_valid 4 2062.64 0.00 0.0812063 0.0000000 15 v dd _io13 2244.96 0.00 0.0883843 0.0000000 16 d gnd 14 2376.00 0.00 0.0935433 0.0000000 17 strobe 2568.80 0.00 0.1011339 0.0000000 18 v dd _io14 2751.12 0.00 0.1083118 0.0000000 19 d gnd 15 2882.16 0.00 0.1134709 0.0000000 20 d out 1 3074.96 0.00 0.1210614 0.0000000 21 v dd _io15 3257.28 0.00 0.1282394 0.0000000 22 d gnd 16 3388.32 0.00 0.1333984 0.0000000 23 pixclk 3581.12 0.00 0.1409890 0.0000000 24 v dd _io16 3763.44 0.00 0.1481669 0.0000000 25 d gnd 17 3894.48 0.00 0.1533260 0.0000000 26 d out 2 4087.28 0.00 0.1609165 0.0000000 27 v dd _io17 4269.60 0.00 0.1680945 0.0000000 28 d gnd 18 4400.64 0.00 0.1732535 0.0000000 29 d gnd 1 4531.68 0.00 0.1784126 0.0000000 30 d gnd 2 4662.72 0.00 0.1835717 0.0000000 31 test 3 4816.14 0.00 0.1896116 0.0000000 32 v dd _io18 4974.48 0.00 0.1958457 0.0000000 33 d gnd 19 5105.52 0.00 0.2010047 0.0000000 34 v dd 1 5247.36 0.00 0.2065890 0.0000000 35 v dd 2 5389.20 0.00 0.2121732 0.0000000 36 d gnd 3 5520.24 0.00 0.2173323 0.0000000 37 d gnd 4 5651.28 0.00 0.2224913 0.0000000 38 d out 11 6098.87 C309.39 0.2401128 C0.0121805 39 d out 10 6098.87 C542.67 0.2401128 C0.0213648 40 d out 9 6098.87 C775.95 0.2401128 C0.0305490 41 v dd _io8 6098.87 C958.27 0.2401128 C0.0377270 42 v dd _io7 6098.87 C1100.11 0.2401128 C0.0433112
pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 6 ?2008 aptina imaging corporation. all rights reserved. MT9M012: 1.6mp cmos digital image sensor die bond pad identification tables 43 d gnd 9 6098.87 C1995.02 0.2401128 C0.0785439 44 dnu 2 6098.87 C2126.86 0.2401128 C0.0837344 45 dnu 6098.87 C2382.79 0.2401128 C0.0938104 46 test 3 6098.87 C2514.63 0.2401128 C0.0990010 47 dnu 6098.87 C2646.47 0.2401128 C0.1041915 48 dnu 6098.87 C2902.40 0.2401128 C0.1142675 49 test 6098.87 C3034.24 0.2401128 C0.1194581 50 dnu 6098.87 C3166.08 0.2401128 C0.1246486 51 dnu 6098.87 C3422.01 0.2401128 C0.1347246 52 extclk 6098.87 C3796.54 0.2401128 C0.1494701 53 v dd _pll 6098.87 C3944.09 0.2401128 C0.1552789 54 d gnd 30 6098.87 C4075.13 0.2401128 C0.1604380 55 v dd _io6 6098.87 C4980.87 0.2401128 C0.1960970 56 v dd _io5 6098.87 C5122.71 0.2401128 C0.2016813 57 d out 6 6098.87 C5315.51 0.2401128 C0.2092719 58 d out 7 6098.87 C5548.79 0.2401128 C0.2184561 59 d out 8 6098.87 C5782.07 0.2401128 C0.2276404 60 d gnd 8 5651.28 C6070.13 0.2224913 C0.2389815 61 d gnd 7 5520.24 C6070.13 0.2173323 C0.2389815 62 v dd 4 5378.40 C6070.13 0.2117480 C0.2389815 63 v dd 3 5236.56 C6070.13 0.2061638 C0.2389815 64 d gnd 29 5105.52 C6070.13 0.2010047 C0.2389815 65 v dd _io28 4963.68 C6070.13 0.1954205 C0.2389815 66 test 4810.27 C6070.13 0.1893805 C0.2389815 67 d gnd 6 4662.72 C6070.13 0.1835717 C0.2389815 68 d gnd 5 4531.68 C6070.13 0.1784126 C0.2389815 69 d gnd 28 4400.64 C6070.13 0.1732535 C0.2389815 70 v dd _io27 4258.80 C6070.13 0.1676693 C0.2389815 71 s data 4066.00 C6070.13 0.1600787 C0.2389815 72 d gnd 27 3894.48 C6070.13 0.1533260 C0.2389815 73 v dd _io26 3752.64 C6070.13 0.1477417 C0.2389815 74 sclk 3599.23 C6070.13 0.1417018 C0.2389815 75 d gnd 26 3451.68 C6070.13 0.1358929 C0.2389815 76 v dd _io25 3309.84 C6070.13 0.1303087 C0.2389815 77 test 3156.43 C6070.13 0.1242687 C0.2389815 78 d gnd 25 3008.88 C6070.13 0.1184598 C0.2389815 79 v dd _io24 2867.04 C6070.13 0.1128756 C0.2389815 80 d out 5 2674.24 C6070.13 0.1052850 C0.2389815 81 d gnd 24 2502.72 C6070.13 0.0985323 C0.2389815 82 v dd _io23 2360.88 C6070.13 0.0929480 C0.2389815 83 test 2207.47 C6070.13 0.0869081 C0.2389815 84 d gnd 23 2059.92 C6070.13 0.0810992 C0.2389815 85 v dd _io22 1918.08 C6070.13 0.0755150 C0.2389815 86 d out 4 1725.28 C6070.13 0.0679244 C0.2389815 table 1: bond pad location and identification from center of pad 1 (continued) pad name pad number x 1 microns y 1 microns x 1 inches y 1 inches
pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 7 ?2008 aptina imaging corporation. all rights reserved. MT9M012: 1.6mp cmos digital image sensor die bond pad identification tables notes: 1. reference to center of each bond pad from center of bond pad 1. 2. dnu = do not use. see bonding instructions on page 3. 3. all test bond pads must be tied to d gnd for normal device operation. 4. line_valid requires an external pull-down resistor (typically 10kC100k ) to dgnd for normal device operation. 87 d gnd 22 1553.76 C6070.13 0.0611717 C0.2389815 88 v dd _io21 1411.92 C6070.13 0.0555874 C0.2389815 89 reset_bar 1258.51 C6070.13 0.0495474 C0.2389815 90 d gnd 21 1110.96 C6070.13 0.0437386 C0.2389815 91 v dd _io20 969.12 C6070.13 0.0381543 C0.2389815 92 d out 3 776.32 C6070.13 0.0305638 C0.2389815 93 d gnd 20 604.80 C6070.13 0.0238110 C0.2389815 94 v dd _io19 462.96 C6070.13 0.0182268 C0.2389815 95 v dd _io4 321.12 C6070.13 0.0126425 C0.2389815 96 v dd _io3 179.28 C6070.13 0.0070583 C0.2389815 97 v aa 1 C368.71 C5445.27 C0.0145159 C0.2143805 98 v aa 2 C368.71 C5303.43 C0.0145159 C0.2087963 99 v aa 3 C368.71 C5161.59 C0.0145159 C0.2032120 100 a gnd 1 C368.71 C5019.75 C0.0145159 C0.1976278 101 a gnd 2 C368.71 C4888.71 C0.0145159 C0.1924687 102 a gnd 3 C368.71 C4757.67 C0.0145159 C0.1873096 103 dnu C368.71 C4221.27 C0.0145159 C0.1661915 104 dnu C368.71 C4090.23 C0.0145159 C0.1610325 105 dnu C368.71 C3959.19 C0.0145159 C0.1558734 106 v aa 4 C368.71 C3383.91 C0.0145159 C0.1332246 107 v aa 5 C368.71 C3242.07 C0.0145159 C0.1276404 108 v aa 6 C368.71 C3100.23 C0.0145159 C0.1220561 109 a gnd 4 C368.71 C2969.19 C0.0145159 C0.1168970 110 a gnd 5 C368.71 C2838.15 C0.0145159 C0.1117380 111 a gnd 6 C368.71 C2707.11 C0.0145159 C0.1065789 112 vaa_pix1 C368.71 C2374.47 C0.0145159 C0.0934829 113 vaa_pix2 C368.71 C2243.43 C0.0145159 C0.0883238 114 vaa_pix3 C368.71 C2112.39 C0.0145159 C0.0831648 115 vaa_pix4 C368.71 C1981.35 C0.0145159 C0.0780057 116 vaa_pix5 C368.71 C1850.31 C0.0145159 C0.0728467 117 vaa_pix6 C368.71 C1719.27 C0.0145159 C0.0676876 118 dnu C368.71 C1501.83 C0.0145159 C0.0591270 119 a gnd 7 C368.71 C1284.39 C0.0145159 C0.0505663 120 a gnd 8 C368.71 C1153.35 C0.0145159 C0.0454073 121 a gnd 9 C368.71 C1022.31 C0.0145159 C0.0402482 122 v aa 7 C368.71 C880.47 C0.0145159 C0.0346640 123 v aa 8 C368.71 C738.63 C0.0145159 C0.0290797 124 v aa 9 C368.71 C596.79 C0.0145159 C0.0234955 table 1: bond pad location and identification from center of pad 1 (continued) pad name pad number x 1 microns y 1 microns x 1 inches y 1 inches
pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 8 ?2008 aptina imaging corporation. all rights reserved. MT9M012: 1.6mp cmos digital image sensor die bond pad identification tables table 2: bond pad location and identification from center of die pad number pad name x 1 microns y 1 microns x 1 inches y 1 inches 1v dd _io1 C2865.08 3035.07 C0.1127984 0.1194907 2v dd _io2 C2723.24 3035.07 C0.1072142 0.1194907 3v dd _io9 C2581.40 3035.07 C0.1016299 0.1194907 4d gnd 10 C2450.36 3035.07 C0.0964709 0.1194907 5 trigger C2296.95 3035.07 C0.0904309 0.1194907 6v dd _io10 C2138.60 3035.07 C0.0841969 0.1194907 7d gnd 11 C2007.56 3035.07 C0.0790378 0.1194907 8d out 0 C1814.76 3035.07 C0.0714472 0.1194907 9v dd _io11 C1632.44 3035.07 C0.0642693 0.1194907 10 d gnd 12 C1501.40 3035.07 C0.0591102 0.1194907 11 frame_valid C1308.60 3035.07 C0.0515197 0.1194907 12 v dd _io12 C1126.28 3035.07 C0.0443417 0.1194907 13 d gnd 13 C995.24 3035.07 C0.0391827 0.1194907 14 line_valid 4 C802.44 3035.07 C0.0315921 0.1194907 15 v dd _io13 C620.12 3035.07 C0.0244142 0.1194907 16 d gnd 14 C489.08 3035.07 C0.0192551 0.1194907 17 strobe C296.28 3035.07 C0.0116646 0.1194907 18 v dd _io14 C113.96 3035.07 C0.0044866 0.1194907 19 d gnd 15 17.08 3035.07 0.0006724 0.1194907 20 d out 1 209.88 3035.07 0.0082630 0.1194907 21 v dd _io15 392.20 3035.07 0.0154409 0.1194907 22 d gnd 16 523.24 3035.07 0.0206000 0.1194907 23 pixclk 716.04 3035.07 0.0281906 0.1194907 24 v dd _io16 898.36 3035.07 0.0353685 0.1194907 25 d gnd 17 1029.40 3035.07 0.0405276 0.1194907 26 d out 2 1222.20 3035.07 0.0481181 0.1194907 27 v dd _io17 1404.52 3035.07 0.0552961 0.1194907 28 d gnd 18 1535.56 3035.07 0.0604551 0.1194907 29 d gnd 1 1666.60 3035.07 0.0656142 0.1194907 30 d gnd 2 1797.64 3035.07 0.0707732 0.1194907 31 test 3 1951.06 3035.07 0.0768132 0.1194907 32 v dd _io18 2109.40 3035.07 0.0830472 0.1194907 33 d gnd 19 2240.44 3035.07 0.0882063 0.1194907 34 v dd 1 2382.28 3035.07 0.0937906 0.1194907 35 v dd 2 2524.12 3035.07 0.0993748 0.1194907 36 d gnd 3 2655.16 3035.07 0.1045339 0.1194907 37 d gnd 4 2786.20 3035.07 0.1096929 0.1194907 38 d out 11 3233.79 2725.68 0.1273144 0.1073102 39 d out 10 3233.79 2492.40 0.1273144 0.0981260 40 d out 9 3233.79 2259.12 0.1273144 0.0889417 41 v dd _io8 3233.79 2076.80 0.1273144 0.0817638 42 v dd _io7 3233.79 1934.96 0.1273144 0.0761795 43 d gnd 9 3233.79 1040.05 0.1273144 0.0409469 44 dnu 2 3233.79 908.21 0.1273144 0.0357563
pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 9 ?2008 aptina imaging corporation. all rights reserved. MT9M012: 1.6mp cmos digital image sensor die bond pad identification tables 45 dnu 3233.79 652.28 0.1273144 0.0256803 46 test 3 3233.79 520.44 0.1273144 0.0204898 47 dnu 2 3233.79 388.60 0.1273144 0.0152992 48 dnu 3233.79 132.67 0.1273144 0.0052232 49 test 3233.79 0.83 0.1273144 0.0000327 50 dnu 3233.79 C131.01 0.1273144 C0.0051579 51 dnu 3233.79 C386.94 0.1273144 C0.0152339 52 extclk 3233.79 C761.48 0.1273144 C0.0299793 53 v dd _pll 3233.79 C909.02 0.1273144 C0.0357882 54 d gnd 30 3233.79 C1040.06 0.1273144 C0.0409472 55 v dd _io6 3233.79 C1945.80 0.1273144 C0.0766063 56 v dd _io5 3233.79 C2087.64 0.1273144 C0.0821906 57 d out 6 3233.79 C2280.44 0.1273144 C0.0897811 58 d out 7 3233.79 C2513.72 0.1273144 C0.0989654 59 d out 8 3233.79 C2747.00 0.1273144 C0.1081496 60 d gnd 8 2786.20 C3035.07 0.1096929 C0.1194907 61 d gnd 7 2655.16 C3035.07 0.1045339 C0.1194907 62 v dd 4 2513.32 C3035.07 0.0989496 C0.1194907 63 v dd 3 2371.48 C3035.07 0.0933654 C0.1194907 64 d gnd 29 2240.44 C3035.07 0.0882063 C0.1194907 65 v dd _io28 2098.60 C3035.07 0.0826220 C0.1194907 66 test 1945.19 C3035.07 0.0765821 C0.1194907 67 d gnd 6 1797.64 C3035.07 0.0707732 C0.1194907 68 d gnd 5 1666.60 C3035.07 0.0656142 C0.1194907 69 d gnd 28 1535.56 C3035.07 0.0604551 C0.1194907 70 v dd _io27 1393.72 C3035.07 0.0548709 C0.1194907 71 s data 1200.92 C3035.07 0.0472803 C0.1194907 72 d gnd 27 1029.40 C3035.07 0.0405276 C0.1194907 73 v dd _io26 887.56 C3035.07 0.0349433 C0.1194907 74 sclk 734.15 C3035.07 0.0289033 C0.1194907 75 d gnd 26 586.60 C3035.07 0.0230945 C0.1194907 76 v dd _io25 444.76 C3035.07 0.0175102 C0.1194907 77 test 291.35 C3035.07 0.0114703 C0.1194907 78 d gnd 25 143.80 C3035.07 0.0056614 C0.1194907 79 v dd _io24 1.96 C3035.07 0.0000772 C0.1194907 80 d out 5 C190.84 C3035.07 C0.0075134 C0.1194907 81 d gnd 24 C362.36 C3035.07 C0.0142661 C0.1194907 82 v dd _io23 C504.20 C3035.07 C0.0198504 C0.1194907 83 test C657.62 C3035.07 C0.0258904 C0.1194907 84 d gnd 23 C805.16 C3035.07 C0.0316992 C0.1194907 85 v dd _io22 C947.00 C3035.07 C0.0372835 C0.1194907 86 d out 4 C1139.80 C3035.07 C0.0448740 C0.1194907 87 d gnd 22 C1311.32 C3035.07 C0.0516268 C0.1194907 88 v dd _io21 C1453.16 C3035.07 C0.0572110 C0.1194907 table 2: bond pad location and identification from center of die (continued) pad number pad name x 1 microns y 1 microns x 1 inches y 1 inches
pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 10 ?2008 aptina imaging corporation. all rights reserved. MT9M012: 1.6mp cmos digital image sensor die bond pad identification tables notes: 1. reference to center of each bond pad from center of die. 2. dnu = do not use. see bonding instructions on page 3. 3. all test bond pads must be tied to d gnd for normal device operation. 4. line_valid requires an external pull-down resistor (typically 10kC100k ) to dgnd for normal device operation. 89 reset_bar C1606.58 C3035.07 C0.0632510 C0.1194907 90 d gnd 21 C1754.12 C3035.07 C0.0690598 C0.1194907 91 v dd _io20 C1895.96 C3035.07 C0.0746441 C0.1194907 92 d out 3 C2088.76 C3035.07 C0.0822346 C0.1194907 93 d gnd 20 C2260.28 C3035.07 C0.0889874 C0.1194907 94 v dd _io19 C2402.12 C3035.07 C0.0945717 C0.1194907 95 v dd _io4 C2543.96 C3035.07 C0.1001559 C0.1194907 96 v dd _io3 C2685.80 C3035.07 C0.1057402 C0.1194907 97 v aa 1 C3233.79 C2410.20 C0.1273144 C0.0948898 98 v aa 2 C3233.79 C2268.36 C0.1273144 C0.0893055 99 v aa 3 C3233.79 C2126.52 C0.1273144 C0.0837213 100 a gnd 1 C3233.79 C1984.68 C0.1273144 C0.0781370 101 a gnd 2 C3233.79 C1853.64 C0.1273144 C0.0729780 102 a gnd 3 C3233.79 C1722.60 C0.1273144 C0.0678189 103 dnu C3233.79 C1186.20 C0.1273144 C0.0467008 104 dnu C3233.79 C1055.16 C0.1273144 C0.0415417 105 dnu C3233.79 C924.12 C0.1273144 C0.0363827 106 v aa 4 C3233.79 C348.84 C0.1273144 C0.0137339 107 v aa 5 C3233.79 C207.00 C0.1273144 C0.0081496 108 v aa 6 C3233.79 C65.16 C0.1273144 C0.0025654 109 a gnd 4 C3233.79 65.88 C0.1273144 0.0025937 110 a gnd 5 C3233.79 196.92 C0.1273144 0.0077528 111 a gnd 6 C3233.79 327.96 C0.1273144 0.0129118 112 vaa_pix1 C3233.79 660.60 C0.1273144 0.0260079 113 vaa_pix2 C3233.79 791.64 C0.1273144 0.0311669 114 vaa_pix3 C3233.79 922.68 C0.1273144 0.0363260 115 vaa_pix4 C3233.79 1053.72 C0.1273144 0.0414850 116 vaa_pix5 C3233.79 1184.76 C0.1273144 0.0466441 117 vaa_pix6 C3233.79 1315.80 C0.1273144 0.0518031 118 dnu C3233.79 1533.24 C0.1273144 0.0603638 119 a gnd 7 C3233.79 1750.68 C0.1273144 0.0689244 120 a gnd 8 C3233.79 1881.72 C0.1273144 0.0740835 121 a gnd 9 C3233.79 2012.76 C0.1273144 0.0792425 122 v aa 7 C3233.79 2154.60 C0.1273144 0.0848268 123 v aa 8 C3233.79 2296.44 C0.1273144 0.0904110 124 v aa 9 C3233.79 2438.28 C0.1273144 0.0959953 table 2: bond pad location and identification from center of die (continued) pad number pad name x 1 microns y 1 microns x 1 inches y 1 inches
pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 11 ?2008 aptina imaging corporation. all rights reserved. MT9M012: 1.6mp cmos digital image sensor die die features die features figure 2: die outline (top view) 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 96 94 92 90 88 86 84 82 80 78 76 74 72 70 68 66 64 62 60 95 93 91 89 87 85 83 81 79 77 75 73 71 69 67 65 63 61 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 optical center from die center (C102.19m, C70.87m) die center (0m, 0m) +y -y +x -x center of pad 1 (table 1) or center of die (table 2) pixel array first clear pixel (col. 0, row 52) last clear pixel (col. 1,471, row 1,147) die id and logo location
pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 12 ?2008 aptina imaging corporation. all rights reserved. MT9M012: 1.6mp cmos digital image sensor die physical specifications physical specifications figure 3: die orientation in reconstructed wafer table 3: physical dimensions feature dimensions die thickness 200 m 12 m singulated die size (after wafer saw) width (x dimension): length (y dimension): 6,748 25 m 6,351 25 m bond pad size (min) 85 m x 100 m passivation openings (min) 75 m x 90 m minimum bond pad pitch 131 m optical array optical center from die center: optical center from center of pad 1: x = ? 102.19 m, y = ? 70.87 m x = 2,762.90 m, y = ? 3,105.93 m first clear pixel (col. 0, row 52) from die center: from center of pad 1: x = 1,515.92 m, y = 1,133.64 m x = 4,381.00 m, y = ? 1,901.43 m last clear pixel (col. 1,471, row 1,147) from die center: from center of pad 1: x = ? 1,720.29 m, y = ? 1,275.37 m x = 1,144.8 m, y = ? 4,310.43 m singulated die size: width: 6,748m 25m length: 6,351m 25m reconstructed wafer street width: 762m number of rows: 28 number of columns: 26 dicing tape: adwill d-175 film frame: disco maximum total die count: 540 276mm 276mm bond pad 1 orientation 762m 762m 6,748m 6,351m
10 eunos road 8 13-40, singapore post center, singapore 408600 prodmktg@aptina.com www.aptina.com aptina, aptina imaging, digitalclarity, and the aptina logo are the property of aptina imaging corporation all other trademarks are the property of their respective owners. this data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. alt hough considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. MT9M012: 1.6mp cmos digital image sensor die revision history pdf: 3518383133/source: 6156369317 aptina reserves the right to change products or specifications without notice. MT9M012_dds - rev. c; pub. 5/10 en 13 ?2008 aptina imaging corporation all rights reserved. revision history rev. c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/10 ? updated to non-confidential rev. b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/10 ? updated to aptina template rev. a . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7/08 ?initial release

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